Wafer-scale and universal van der Waals metal semiconductor contact

Van der Waals (vdW) metallic contacts have shown promise in reducing contact resistance and minimizing Fermi level pinning in two-dimensional (2D) semiconductors. However, limited metals are suitable for mechanical lamination, and this process lacks scalability. This paper presents a wafer-scale, universal vdW metal integration strategy using a thermally decomposable polymer buffer layer. Various metals (Ag, Al, Ti, Cr, Ni, Cu, Co, Au, Pd) were directly deposited onto 2D semiconductors without damage, and the polymer was removed via thermal annealing. This method was also successfully applied to bulk semiconductors, reducing Fermi level pinning.

Lingan Kong, Ruixia Wu, Yang Chen, Ying Huangfu, Liting Liu, Wei Li, Donglin Lu, Quanyang Tao, Wenjing Song, Wanying Li, Zheyi Lu, Xiao Liu, Yunxin Li, Zhiwei Li, Wei Tong, Shuimei Ding, Songlong Liu, Likuan Ma, Liwang Ren, Yiliu Wang, Lei Liao, Xidong Duan, Yuan Liu