Engineering and Technology

Wafer-scale and universal van der Waals metal semiconductor contact

L. Kong, R. Wu, et al.

Explore the groundbreaking advancements in integrating van der Waals metallic contacts with two-dimensional semiconductors, significantly reducing contact resistance and Fermi level pinning. This innovative wafer-scale approach, utilizing a thermally decomposable polymer buffer layer, has been developed by a team of experts including Lingan Kong, Ruixia Wu, and Yang Chen.

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