Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

This paper demonstrates an interpenetrating architecture of electrocaloric polymer with highly thermally conductive pathways that achieves a 240% increase in electrocaloric performance and a 300% enhancement in the thermal conductivity of the polymer. A scaled-up device prototype for single heat spot cooling of a 5G chip is fabricated using this electrocaloric composite and electromagnetic actuation. The 3-D thermal conductive network acts as nucleation sites for ordered dipoles, efficiently collecting thermal energy and facilitating phonon conduction. This synergy addresses the challenge of sluggish heat dissipation in electroactive polymers, significantly reducing electric energy consumption and increasing manipulable entropy at low fields. This solution is proposed for precise thermal management in next-generation microelectronic devices.

Ming-Ding Li, Xiao-Quan Shen, Xin Chen, Jia-Ming Gan, Fang Wang, Jian Li, Xiao-Liang Wang, Qun-Dong Shen