Engineering and Technology
Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration
M. Li, X. Shen, et al.
This cutting-edge research by Ming-Ding Li and colleagues presents a revolutionary electrocaloric polymer architecture that significantly enhances thermal management in next-generation microelectronics. The implementation of a 3-D conductive network boosts electrocaloric performance and thermal conductivity, promising substantial reductions in electric energy consumption.
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