logo
Loading...
Bending reliability of screen-printed vias for a flexible energy module
Engineering and Technologynpj Flexible Electronics

Bending reliability of screen-printed vias for a flexible energy module

M. Kujala, T. Kololuoma, et al.

This research evaluates the bending reliability of screen-printed through-hole vias using silver microparticle inks, providing insights into their durability for flexible energy solutions. Conducted by Manu Kujala, Terho Kololuoma, Jari Keskinen, Donald Lupo, Matti Mäntysalo, and Thomas M. Kraft, the study highlights a significant 100% yield for via filling, suggesting promising applications for roll-to-roll manufacturing of printed electronics.... show more
Introduction
Literature Review
Methodology
Key Findings
Discussion
Conclusion
Limitations
Listen, Learn & Level Up
Over 10,000 hours of research content in 25+ fields, available in 22+ languages.
No more digging through PDFs, just hit play and absorb the world's latest research in your language, on your time.
listen to research audio papers with researchbunny