
Engineering and Technology
Soft, stretchable thermal protective substrates for wearable electronics
S. Nie, M. Cai, et al.
Discover a groundbreaking soft and stretchable thermal protective substrate for wearable electronics, developed by Shuang Nie and colleagues. This innovative composite material significantly enhances thermal insulation while remaining mechanically compliant and highly stretchable, achieving an impressive 82% reduction in peak skin temperature. Experience the future of wearable technology with this remarkable advancement!
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