Engineering and Technology
A universal packaging substrate for mechanically stable assembly of stretchable electronics
Y. Shao, J. Yan, et al.
Innovative stretchable electronics are now a reality thanks to groundbreaking research conducted by Yan Shao and colleagues. Their novel packaging substrate, designed to enhance the adhesion and stretchability of diverse modules even at extreme strains, paves the way for sustainable bioelectronic devices with impressive longevity.
Related Publications
Explore these studies to deepen your understanding of the subject.

