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A universal packaging substrate for mechanically stable assembly of stretchable electronics

Engineering and Technology

A universal packaging substrate for mechanically stable assembly of stretchable electronics

Y. Shao, J. Yan, et al.

Innovative stretchable electronics are now a reality thanks to groundbreaking research conducted by Yan Shao and colleagues. Their novel packaging substrate, designed to enhance the adhesion and stretchability of diverse modules even at extreme strains, paves the way for sustainable bioelectronic devices with impressive longevity.... show more
Citation Metrics
Citations
40
Influential Citations
0
Reference Count
44
Citation by Year

Note: The citation metrics presented here have been sourced from Semantic Scholar and OpenAlex.

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