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A universal packaging substrate for mechanically stable assembly of stretchable electronics
Engineering and TechnologyNature Communications

A universal packaging substrate for mechanically stable assembly of stretchable electronics

Y. Shao, J. Yan, et al.

Innovative stretchable electronics are now a reality thanks to groundbreaking research conducted by Yan Shao and colleagues. Their novel packaging substrate, designed to enhance the adhesion and stretchability of diverse modules even at extreme strains, paves the way for sustainable bioelectronic devices with impressive longevity.... show more
Abstract
Publisher
Nature Communications
Published On
Jul 19, 2024
Authors
Yan Shao, Jianfeng Yan, Yinglin Zhi, Chun Li, Qingxian Li, Kaimin Wang, Rui Xia, Xinyue Xiang, Liqian Liu, Guoli Chen, Hanxue Zhang, Daohang Cai, Haochuan Wang, Xing Cheng, Canhui Yang, Fuzeng Ren, Yanhao Yu
Tags
stretchable electronicspackaging substratemolecular mobilitybioelectronic deviceadhesiveness
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