This paper proposes a design for a modular multi-parameter electronic skin inspired by the layered structure and distributed mechanoreceptors of human skin. The electronic skin uses a stress field sensing concept to transform complex tactile signals into field information, enabling the resolution of real-time three-dimensional forces with high spatial resolution. It can also detect object hardness. The modular design allows for random assembly and integration onto curved surfaces without affecting measurements, making it versatile for various applications.
