
Engineering and Technology
Foldable three dimensional neural electrode arrays for simultaneous brain interfacing of cortical surface and intracortical multilayers
J. Y. Lee, S. H. Park, et al.
Explore the groundbreaking research by Ju Young Lee and colleagues, showcasing a revolutionary foldable and flexible 3D neural prosthetic designed for immersive 3D mapping of neural circuits. This advanced device offers insights into complex brain signal dynamics and could pave the way for next-generation neural interfaces.
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