9th International Conference on Smart Materials Applications (ICSMA 2026)

Date: January 28-30, 2026
Location: Tokyo University of Science, Tokyo, Japan

About the Conference

The 9th International Conference on Smart Materials Applications (ICSMA 2026) is co-organized by:

• South Asia Institute of Science and Engineering (SAISE)
• Tokyo University of Science, Japan
• Yonsei University, South Korea
• Sichuan University, China

This conference aims to bring together leaders from industry and academia to:

• Exchange and share experiences
• Present research results
• Explore collaborations
• Spark new ideas for developing projects and exploiting new technologies

The program will include invited, oral, and poster presentations from scientists working in similar areas, establishing platforms for collaborative research projects in the field of smart materials.

Conference Proceedings

• All submissions will be peer-reviewed.
• Registered and presented papers will be published in the Conference Proceedings, indexed by Elsevier: SCOPUS.

Call for Papers

Topics of Interest

Submissions are invited on topics including, but not limited to:

• Materials Science and Engineering
• Materials Properties, Measuring Methods, and Applications
• Methodology of Research, Analysis, and Modeling
• Materials Manufacturing and Processing

For more information, please visit: http://www.icsma.org

Submission Details

• Submission Link: http://confsys.iconf.org/submission/icsma2026
• Page Requirements:
  • Each paper should have no fewer than 5 pages, including all figures, tables, and references.
  • One regular registration covers up to 6 pages.
  • Extra pages will incur additional charges.

Contact Information

For inquiries, please contact:

Ms. Loey Liu
Conference Secretary of ICSMA

• Email: icsma@saise.org
• Tel:
  • +852-36789835 (Hong Kong)
  • +86-15008402564 (China)

Office Hours:

• 9:30 – 18:00 (UTC+8)
• Monday to Friday