9th International Conference on Smart Materials Applications (ICSMA 2026)
Jan 19, 2026 - Jan 21, 2026
Tokyo, Japan
CONFERENCE
Event Details
All submissions will be peer-reviewed. The registered and presented papers will be published in the Conference Proceedings, indexed by Elsevier: SCOPUS.
Call for Papers
Topics of interest for submission include, but are not limited to:
- Materials Science and Engineering
- Materials Properties
- Measuring Methods and Applications
- Methodology of Research and Analysis and Modeling
- Materials Manufacturing and Processing
For more information, please visit ICSMA Website.
Submission Details
- Submission Link: Submit Your Paper
Page Requirements
- Each paper should have no less than 5 pages, including all figures, tables, and references.
- One regular registration covers up to six pages. Extra pages will incur additional charges.
Contact Information
For any inquiries about the conference, please contact:
Ms. Loey Liu
Conference Secretary of ICSMA
- Email: icsma@saise.org
- Tel: +852-36789835 (Hong Kong) / +86-15008402564 (China)
- Office Time: 9:30 – 18:00, Time zone: UTC+8; Monday to Friday
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