5th International Conference on Electron Devices and Applications (ICEDA 2025)

Publication

Submitted papers will be peer-reviewed by program committees and technical committee. Accepted papers will be published in the conference proceedings by IEEE after registration and presentation. The proceedings will be submitted for inclusion in IEEE Xplore and indexed by Ei Compendex and Scopus.

Organizing Committees

Honorary Chair

• Xin Cheng, Southern University of Science and Technology, China

Advisory Chairs

• Yang Chai (Fellow of IEEE), The Hong Kong Polytechnic University, Hong Kong, China
• Anquan Jiang, Fudan University, China
• Hongming Chen, Zhejiang Ocean University, China

Conference Chairs

• Xiaoqing Wen, Kyushu Institute of Technology, Japan (Fellow of IEEE)
• Keping Wang, Tianjin University, China
• Hao Yu, Southern University of Science and Technology, China

Program Chairs

• Bo Liang, Zhejiang University, China
• Lianming Li, Southeast University, China
• Yunfang Jia, Nankai University, China
• Fengwei An, Southern University of Science and Technology, China
• Xiaobing Yan, Hebei University, China

Program Co-Chairs

• Ben Abdallah Abderazek, University of Aizu, Japan
• Wenhua Gu, Nanjing University of Science and Technology, China
• Zhen Wen, Soochow University, China
• Yanli Zou, Guangxi Normal University, China

For more committees, please visit: Organizing Committees

Keynote Speakers

• Prof. Yang Chai
  Chair Professor of Semiconductor Physics
  Associate Dean of Faculty of Science (Research)
  The Hong Kong Polytechnic University, Hong Kong, China
  IEEE Fellow, IEEE Distinguished Lecturer, Associate Editor of ACS Nano

• Prof. Anquan Jiang
  Fudan University, China

Invited Speakers

• Prof. Kumar T. Nandha
  The University of Nottingham Malaysia Campus, Malaysia

• Asst. Prof. Can Li
  The University of Hong Kong, Hong Kong, China

Topics

Topics of interest for submission include, but are not limited to:

Track 1: Semiconductor Devices & Materials

• Advanced semiconductor materials (SiC, GaN, 2D materials)
• High-performance transistors (FinFET, GAA, TFET)
• Power semiconductor devices and modules

Track 2: Integrated Circuits & VLSI Design

• Analog/mixed-signal IC design
• RF and millimeter-wave integrated circuits
• Low-power and energy-efficient ICs

Track 3: Optoelectronics & Photonic Devices

• Photodetectors and image sensors
• LEDs, lasers, and display technologies
• Silicon photonics and plasmonics

Track 4: Power Electronics & Energy Devices

• Power converters and inverters
• Energy harvesting devices and systems
• Battery management systems (BMS)

Track 5: Emerging Technologies & Applications

• Quantum computing devices
• Bioelectronics and implantable devices
• Wearable and IoT sensor technologies

Track 6: Device Modeling, Fabrication & Reliability

• Circuits, Devices, and Systems
• Compact modeling of electron devices
• Process simulation and TCAD tools

For more topics, please visit: Call for Papers

Submission Instructions

• Language: English is the official language. Papers should be written and presented only in English.
• Presentation & Publication:
  • To make a presentation and publish your paper, submit a full paper (no less than 5 pages, two-column).
  • To make a presentation only, submit an abstract (200–400 words).
• Extra Pages: If the length of the full paper exceeds 6 pages, an extra fee of 60 USD/400 RMB per page will be charged.

Submission Methods

1. Online Submission System: Submit Here
2. Email: icedaconf@vip.163.com

Template

Please format your paper according to the provided template: Download Template

Contact Us

• Conference Secretary: Miss Adela Zhong
• Email: iceda_contact@163.com
• Tel: +86-19180927671
• Website: ICEDA Official Website
• Office Hours: 9:30–18:00, Monday to Friday (GMT+8 Time Zone)