9th International Conference on Electronics Technology (ICET 2026)

Proceedings

Accepted papers will be published in the IEEE conference proceedings, included in IEEE Xplore, and submitted for indexing in Ei Compendex and Scopus after the conference.

SCI & EI Journals

Selected papers will be recommended to the following journals after successful registration and proper extension. Submissions will be considered for SCI, EI Compendex, and Scopus indexing. Please indicate your preference when submitting.

Journals:

• Journal of Electronic Science and Technology (ISSN: 1674-862X)

  • Citescore Track: 5.7

• International Journal of Electrical Power & Energy Systems (ISSN: 0142-0615)

  • Impact Factor: 5.0
  • CiteScore: 13.0

• Discover Nano (ISSN: 2731-9229)

  • Impact Factor: 4.5

Previous ICET Conferences

Past Editions:

• ICET 2025

  • IEEE ISBN: 979-8-3315-1938-4
  • Indexed in Ei
  • Online in Xplore

• ICET 2024

  • IEEE ISBN: 979-8-3503-6395-1
  • Indexed in Ei
  • Online in Xplore

• ICET 2023

  • IEEE ISBN: 979-8-3503-3768-6
  • Indexed in Scopus & Ei
  • Online in Xplore

• ICET 2022

  • IEEE ISBN: 978-1-6654-8508-1
  • Indexed in Scopus & Ei
  • Online in Xplore

• ICET 2021

  • IEEE ISBN: 978-1-7281-7672-7
  • Indexed in Scopus & Ei
  • Online in Xplore

• ICET 2020

  • IEEE ISBN: 978-1-7281-6282-9
  • Indexed in Scopus & Ei
  • Online in Xplore

• ICET 2019

  • IEEE ISBN: 978-1-7281-1617-4
  • Indexed in Scopus & Ei
  • Online in Xplore

• ICET 2018

  • IEEE ISBN: 978-1-5386-5750-8
  • Indexed in Scopus & Ei
  • Online in Xplore

Call for Papers

Tracks:

1. Antennas and Microwaves

   • Chair: Shiwen Yang, University of Electronic Science and Technology of China
   • Co-chair: Zhiqin Zhao, University of Electronic Science and Technology of China

2. Electronics Materials and Devices

   • Chair: Yuan Lin, University of Electronic Science and Technology of China
   • Co-chairs: Taisong Pan, Haimeng Huang, University of Electronic Science and Technology of China

3. Communication and Networks

   • Chair: Gang Feng, University of Electronic Science and Technology of China
   • Co-chair: Hongfang Yu, University of Electronic Science and Technology of China

4. Power and Electrical Engineering

   • Chair: Weihao Hu, University of Electronic Science and Technology of China
   • Co-chair: Fang Deng, Whirlpool Corporation, USA

5. Aerospace & Electronics Systems

   • Chair: Hui Li, University of Electronic Science and Technology of China
   • Co-chair: Qing Guo, University of Electronic Science and Technology of China

6. Electronics Applications

   • Chair: Junran Zhang, Sichuan University, China
   • Co-chair: Liang Luo, University of Electronic Science and Technology of China

7. Internet of Things

   • Chair: Hong-Ning Dai, Hong Kong Baptist University, China
   • Co-chair: Ke Zhang, University of Electronic Science and Technology of China

8. Embedded System

   • Chair: Fei Qiao, Tsinghua University, China
   • Co-chair: Letian Huang, University of Electronic Science and Technology of China

9. AI and Applications

   • Chair: Nan Cheng, Xidian University, China
   • Co-chair: Huan Zhou, Northwestern Polytechnical University, China

10. Control and Robotics

    • Chair: Jianxiao Zou, University of Electronic Science and Technology of China
    • Co-chair: Haiying Dong, Lanzhou Jiaotong University, China

11. Signal Processing

    • Chair: Wenqin Wang, University of Electronic Science and Technology of China
    • Co-chairs: Yi Liao, University of Electronic Science and Technology of China; Yu Yao, Hainan University, China

12. Advanced Sensors

    • Chair: Guoqiang Wu, Wuhan University, China
    • Co-chairs: Xudong Zou, Aerospace Information Research Institute, CAS, China; Fei Wang, Southern University of Science and Technology, China

13. Flexible Electronics

    • Chair: Xiaosheng Zhang, University of Electronic Science and Technology of China
    • Co-chairs: Chengyi Hou, Donghua University, China; Lili Wang, Institute of Semiconductors, Chinese Academy of Sciences, China

For more tracks, visit: Call for Papers

Special Sessions

Sessions:

1. Emerging Semiconductor Thin Film Materials and Devices

   • Organizers: Jiang Wu, Aobo Ren, Jun Wang (University of Electronic Science and Technology of China)

2. Semiconductor Devices, Integrated Circuits and Applications

   • Organizers: Fengjuan Wang (Xi’an University of Technology), Xiangkun Yin (Xidian University), He Tang (University of Electronic Science and Technology of China)

3. Recent Advances on Radar Technologies for Target Detection, Imaging, and Recognition

   • Organizers: Zhongyu Li (University of Electronic Science and Technology of China), Yong Jia (Chengdu University of Technology)

4. Emerging Computing: From Device, Circuit to System

   • Organizers: Zhiwei Li, Nuo Xu (National University of Defense Technology)

5. Advanced Signal Processing Methods in Geoscience

   • Organizers: Ya-juan Xue (Chengdu University of Information Technology), Wei Chen (Yangtze University), Hui Chen (Chengdu University of Technology)

6. Resource Allocation Schemes for Mono-static/Multi-static Radar Systems

   • Organizers: Chenguang Shi (Nanjing University of Aeronautics and Astronautics), Zhenkai Zhang (Jiangsu University of Science and Technology), Yang Su (Nanjing University of Information Science and Technology)

7. Cloud-Edge-End Collaborative Computing: Methods and Applications

   • Organizer: Jin Sun (Nanjing University of Science and Technology)

8. Key Technologies for Energy Storage and Virtual Power Plants Participating in Power System Operations

   • Organizers: Mingze Zhang (Harbin University of Science and Technology), Jiakai Shen (China Electric Power Research Institute), Cuicui Jin (State Grid Tianjin Electric Power Company), Liu Liu (State Grid JiangXi Electric Power Research Institute), Feixiang Peng (Anhui University)

9. Flexible Sensing and Circuits – Science for an Intelligent World

   • Organizers: Yang Li, Qikai Guo, Xinming Zhuang (Shandong University), Hongsen Niu (Jinan University)

10. High-Frequency/High-Speed Vacuum Micro-Nano-Electronic Devices And Technologies

    • Organizer: Nannan Li (Institute of Electronic Engineering, CAEP)

Submission

• Submit via Easychair: Submission Link
• Listeners are warmly welcomed to register via: Registration Link

Contact Us

• Ms. Amy J.Y. Hu
  • Submission, Registration, Information: icet@zhconf.ac.cn
  • Committee Application, Sponsor: icet_official@vip.163.com
  • Tel: +86-028-8652-8629