11th International Conference on Integrated Circuits and Microsystems(ICICM 2026)

Publication

Submitted papers will be peer-reviewed (double blind), and accepted papers will be included in the IEEE conference proceedings, available on IEEE Xplore and indexed by EI Compendex and Scopus.

ICICM 2016–2024 (previous 9 years) have been successfully indexed by EI Compendex and Scopus.

Submission Guidelines

Paper Types

1. Full Paper (Presentation and Publication):

   • Minimum of 4 full pages.
   • Templates:
     • Download Word Template
     • Download LaTeX Template

2. Abstract (Presentation Only):

   • 300–500 words.

Note: All manuscripts must be written in English.

Submission Methods

• Electronic Submission System: EasyChair
• Email Submission: icicm_conf@vip.163.com

For more details, visit the submission page.

Topics of Interest

The conference covers a wide range of topics, including but not limited to:

Track 1: Electronic Design Automation (EDA)

• Progress of EDA algorithms
• EDA for emerging technologies
• Hardware-software co-design with EDA
• EDA in High Performance Computing (HPC)
• EDA in analog and mixed-signal design

Track 2: Integrated Circuit and System Design

• Digital, analog, mixed-signal IC and SOC design technology
• IC computer-aided design technology, DFM
• Modeling and simulation

Track 3: Semiconductor Devices and Circuits

• Components and circuits for wireless systems
• Low power, RF devices and circuits
• Silicon/Germanium devices and device physics
• Compound semiconductor devices and circuits

Track 4: Process Technology and Manufacturing

• Silicon integrated circuits and manufacturing
• Interconnect, low-K, high-K, and other process technologies
• Packaging and testing technology, equipment technology

For additional topics, please visit the call-for-papers page.

Organizing Committee

Conference Chairs

• Zhigong Wang, Southeast University, China
• Xiulong Wu, Anhui University, China
• Kaixue Ma, Tianjin University, China

Conference Co-Chairs

• Ning Xu, Wuhan University of Technology, China
• Xiaoqing Wen, Kyushu Institute of Technology, Japan
• Qiang Li, University of Electronic Science and Technology of China, China

Program Chairs

• Abdel-Hamid Ali Soliman, Staffordshire University, UK
• Jun Han, Fudan University, China
• Xiaopeng Yu, Zhejiang University, China
• Meng Zhang, Southeast University, China
• Sheng Chang, Wuhan University, China
• Yingmei Chen, Southeast University, China
• Zhikuang Cai, Nanjing University of Posts and Telecommunications, China
• Zhuo Zou, Fudan University, China (IEEE Senior Member)
• Jianguo Hu, Sun Yat-sen University, China
• Bei Yu, The Chinese University of Hong Kong, China

Program Co-Chairs

• Junyong Deng, Xi’an University of Posts & Telecommunications, China
• Jun Xu, Nanjing University, China
• Zhixiong Di, Southwest Jiaotong University, China
• Guojie Luo, Peking University, China
• Xiaojun Zhai, University of Essex, UK
• Wei Xing, The University of Sheffield, UK

Program Committee

• Bo Liu, Southeast University, China
• Shi Pu, Wuhan University of Technology, China
• Haizhi Song, University of Electronic Science and Technology of China, China
• Lu Zhu, Sun Yat-sen University, China
• Youming Zhang, Southeast University, China
• Jianshi Tang, Tsinghua University, China
• Weiguang Sheng, Shanghai Jiao Tong University, China
• Hao Gao, Austria & Eindhoven University of Technology, Netherlands
• Yun Fang, Silicon Austria Labs, Austria
• Jeff Kilby, Auckland University of Technology, New Zealand
• Zhijun Zhou, Southeast University, China
• Xingyuan Tong, Xi’an University of Posts & Telecommunications, China
• Wei Hu, Northwestern Polytechnical University, China
• Zhaori Bi, Fudan University, China
• Zhengfeng Huang, Hefei University of Technology, China

Local Chair

• Lin Cheng, University of Science and Technology of China

Student Program Chairs

• Hongbin Sun, Xi’an Jiaotong University, China
• Keping Wang, Tianjin University, China
• Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China
• Fanyi Meng, Tianjin University, China

Student Program Committee

• Li Du, Nanjing University, China
• Lei Wang, Nanjing University of Posts and Telecommunications, China
• Xianbo Li, Sun Yat-sen University, China
• Tiehu Li, Chongqing University of Technology, China
• Moufu Kong, University of Electronic Science and Technology of China, China
• Jiaxin Liu, University of Electronic Science and Technology of China, China
• Maliang Liu, Xidian University, China
• Xu Meng, Hefei University of Technology, China
• Tianming Ni, Anhui University of Engineering, China
• Qiang Zhao, Anhui University, China

For the full organizing committee list, visit the committee page.

Conference History

• ICICM 2016 | Chengdu | November 23–25, 2016
• ICICM 2017 | Nanjing | November 8–11, 2017
• ICICM 2018 | Shanghai | November 24–26, 2018
• ICICM 2019 | Beijing | October 25–27, 2019
• ICICM 2020 | Nanjing | October 23–25, 2020
• ICICM 2021 | Nanjing | October 22–24, 2021
• ICICM 2022 | Xi’an | October 28–31, 2022
• ICICM 2023 | Nanjing | October 20–23, 2023
• ICICM 2024 | Wuhan | October 25–27, 2024
• ICICM 2025 | Hefei | October 17–19, 2025

Contact Information

Ms. Carrie Lim

• Email: icicm_conf@vip.163.com
• Website: icicm.net
• Phone: (86) 134-0855-5552