IEEE 2026 5th International Conference on Electronics Technology and Artificial Intelligence (ETAI 2026)

Date: March 6–8, 2026
Location: Harbin, China
Conference Website: https://ais.cn/u/UjUZBf

Call for Papers

Topics of Interest

Electronics Technology

• Analog Electronics
• Digital Electronics
• Power Electronics Technology
• Variable Current Technology
• Electronic Device Equipment
• Electronic Signals
• Fiber Optics and Fiber Optic Devices
• Giant Area Microelectronics
• Electronic Information Technology
• Adaptive Signal Processing
• Advanced Electromagnetics
• MEMS Component Technology
• Electronic System Level Design
• Electronics and Nanoelectronics
• Epitaxy and Light Emitting Diodes
• Three-Dimensional Semiconductor Device Technology
• Circuit Analysis and Design
• Communication Electronic Circuits
• Integrated Circuit Design and Integrated Systems
• Microwave Photonic Device Physics
• Integrated Optics
• Micro/Nano Systems and Networks
• Digital Signal Processing

Artificial Intelligence

• Artificial Intelligence Algorithms
• Natural Language Processing
• Fuzzy Logic
• Computer Vision
• Signal and Image Processing
• Speech and Natural Language Processing
• Machine Learning
• Artificial Intelligence Modeling and Simulation
• Pervasive Computing
• Hybrid Intelligent Systems
• Information Retrieval and Fusion
• Microcontroller Technology
• Intelligent Database Systems
• Neural Networks and Complex Systems
• Pattern Recognition and Logic Programs
• Intelligent Control

Publication

All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a thorough review process, all accepted papers will be published in the IEEE Conference Proceedings. These proceedings will be submitted to EI Compendex and Scopus for indexing.

Important Dates

• Full Paper Submission Deadline: January 20, 2026
• Registration Deadline: January 20, 2026
• Final Paper Submission Deadline: February 6, 2026
• Conference Dates: March 6–8, 2026

Paper Submission

Please submit your full paper (Word + PDF) via the Submission System:
https://ais.cn/u/UjUZBf